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| class UCIeStandard:
"""UCIe (Universal Chiplet Interconnect Express) 标准"""
def __init__(self):
self.specifications = {
"版本": "1.0 / 1.1",
"组织": "UCIe Consortium",
"成员": ["Intel", "AMD", "ARM", "Samsung", "TSMC", "台积电等"],
"目标": "芯粒互连开放标准"
}
def protocol_stack(self):
"""协议栈"""
stack = {
"物理层": {
"标准": "支持多种封装技术",
"选项": [
"先进封装 (2.5D/3D)",
"标准封装 (organic)",
"电气"
],
"数据速率": "可达1.5 Tbps/pin"
},
"链路层": {
"功能": "可靠传输，流控",
"特性": [
"CRC校验",
"重传机制",
"流控",
"信用机制"
]
},
"传输层": {
"功能": "端到端通信",
"特性": [
"虚拟通道",
"路由",
"多路复用"
]
},
"适配层": {
"协议": "支持多种协议",
"选项": [
"PCIe",
"CXL",
"RAW",
"自定义协议"
]
}
}
return stack
def implementation_options(self):
"""实现选项"""
options = {
"封装类型": {
"标准封装": {
"互连密度": "100-500 μm pitch",
"带宽": "10-50 GB/s/mm",
"成本": "低",
"应用": "成本敏感场景"
},
"先进封装 (2.5D)": {
"互连密度": "25-55 μm pitch",
"带宽": "100-200 GB/s/mm",
"成本": "中",
"应用": "高性能计算"
},
"先进封装 (3D)": {
"互连密度": "1-10 μm pitch",
"带宽": "1000+ GB/s/mm",
"成本": "高",
"应用": "极致性能"
}
},
"数据速率": {
"低功耗": "4-8 GT/s",
"性能": "8-16 GT/s",
"极致": "16-32+ GT/s"
},
"信道宽度": {
"窄": "8, 16, 32 bits",
"宽": "64, 128, 256 bits",
"可配置": "灵活配置"
}
}
return options
def bandwidth_calculator(self, data_rate_gtps, channel_bits, lanes):
"""带宽计算"""
# 带宽 = 数据速率 × 信道宽度 × 通道数 / 10 (8b/10b编码)
bandwidth_gbps = data_rate_gtps * channel_bits * lanes / 10
return {
"数据速率": f"{data_rate_gtps} GT/s",
"信道宽度": f"{channel_bits}-bit",
"通道数": lanes,
"带宽": f"{bandwidth_gbps} GB/s",
"说明": "考虑8b/10b编码开销"
}
|